{"product_id":"flip-chip-hybrid-bonding-fan-in-and-fan-out-technology-springer-verlag-singapore-9789819721399-john-h-lau","title":"Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology","description":"\u003cp\u003e\u003cstrong\u003eFlip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology\u003c\/strong\u003e by John H. Lau.\u003c\/p\u003e\n\u003cp\u003ePublished by Springer, (2024), Hardback, 501 pages.\u003c\/p\u003e","brand":"John H. Lau","offers":[{"title":"Default Title","offer_id":52264903344470,"sku":"9789819721399","price":181.87,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9789819721399.jpg?v=1767797144","url":"https:\/\/www.bookshop.ee\/products\/flip-chip-hybrid-bonding-fan-in-and-fan-out-technology-springer-verlag-singapore-9789819721399-john-h-lau","provider":"Bookshop","version":"1.0","type":"link"}