{"product_id":"interconnect-reliability-in-advanced-memory-device-packaging-springer-international-publishing-ag-9783031267109-chong-leong-gan","title":"Interconnect Reliability in Advanced Memory Device Packaging","description":"\u003cp\u003eThis book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.   In the past 40 years, memory packaging processes have evolved enormously.\u003c\/p\u003e","brand":"Chong Leong Gan","offers":[{"title":"Default Title","offer_id":52262970818902,"sku":"9783031267109","price":218.24,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9783031267109.jpg?v=1767794596","url":"https:\/\/www.bookshop.ee\/products\/interconnect-reliability-in-advanced-memory-device-packaging-springer-international-publishing-ag-9783031267109-chong-leong-gan","provider":"Bookshop","version":"1.0","type":"link"}