{"product_id":"through-silicon-vias-taylor-francis-ltd-9780367574543-materials-models-design-and-performance-brajesh-kumar-kaushik","title":"Through Silicon Vias","description":"\u003cp\u003eRecent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph\u003c\/p\u003e","brand":"Brajesh Kumar Kaushik","offers":[{"title":"Default Title","offer_id":52257008451926,"sku":"9780367574543","price":63.04,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9780367574543.jpg?v=1767786901","url":"https:\/\/www.bookshop.ee\/products\/through-silicon-vias-taylor-francis-ltd-9780367574543-materials-models-design-and-performance-brajesh-kumar-kaushik","provider":"Bookshop","version":"1.0","type":"link"}