John H. Lau
Hardcover
Chiplet Design and Heterogeneous Integration Packaging
€174,69€199,99
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Chiplet Design and Heterogeneous Integration Packaging
€120,88€137,49
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Assembly and Reliability of Lead-Free Solder Joints
€110,12€124,99
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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
€163,93€187,49
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