• Book cover of: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices. By: Ephraim Suhir

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Ephraim Suhir

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Autorius Ephraim Suhir
Kalba Anglų k.
Žanras Engineering
Leidimo metai 2024 m.
Puslapių skč. 382 psl.
Viršelis Minkštas viršelis
ISBN 9780367635886

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

Book cover of: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices. By: Ephraim Suhir

Avoiding Inelastic Strains in Solder ...

€83,13
€83,13